As well as investing heavily in our surface mount capability, we also maintain a well equipped through-hole facility with skilled, IPC trained operators employed to deliver the highest quality product to our customers.
With a wide range of tools and equipment onsite our operators will form, populate and solder components to your PCBs. For low volume and prototype builds, boards can be populated and skilfully hand soldered by members of the team. For higher volume products we have two Blundell CMS400 wave solder machines in place which offer volume soldering capability for both ROHS and tin-lead requirements respectively.
Cleaning of board assemblies is provided by a Trident Aqueous 3 stage cleaning facility.